Electronics Manufacturing Services (EMS)

Polyfit offers advanced injection moulding solutions for a wide range of product sizes and complexities.

Our capabilities include:

• • Horizontal, vertical, two-platen, twin-color, and all-electric machines
  • Fully automated robotics for consistent, efficient production
  • AI-powered vision systems for real-time defect detection
  • Centralized raw material feeding with auto-dehumidifiers for optimal quality

Our streamlined shop floor features calibrated auxiliary systems, tonnage-specific cranes, and SMED practices for fast, efficient tool changes.

Surface‑Mount Technology (SMT) involves mounting electronic components directly onto printed circuit boards (PCBs) with exceptional precision.

At Polyfit, our Class  7K cleanroom houses a fully automated SMT production line featuring high‑speed pick‑and‑place machines capable of placing up to 90,000 components per hour. Our process includes solder‑paste inspection (SPI), automated‑optical inspection (AOI), and an auto‑rejection conveyor system to ensure continuous, uncompromised quality control throughout the production cycle.

Box build assembly is the process of bringing electronic, electrical, and mechanical components together to create a complete product. Depending on the design, this process may involve PCB installation, cable routing, wiring connections, enclosure fitting, and the integration of various components into a finished assembly.

Our approach to box build assembly focuses on following product specifications, maintaining organized assembly processes, and meeting application-specific requirements. From individual electronic modules to integrated product assemblies, the scope of work depends on the design and manufacturing needs of each project.

In-Circuit Testing (ICT) is a testing method used in electronics manufacturing to examine individual components and electrical connections on a printed circuit board (PCB). It helps identify assembly-related faults before the board moves to the next stage of production.

Depending on the PCB design and test setup, ICT equipment uses probes to access designated test points and measure electrical characteristics. The results are evaluated against predefined test limits to identify potential component or connection problems.

PCBA routing is a PCB depaneling technique used to separate individual printed circuit board assemblies from a shared manufacturing panel. This process is particularly useful when electronic boards have custom outlines, curved edges, or layouts that require controlled separation.

During PCB routing, a cutting tool follows a predefined path around the board profile. The process must account for board dimensions, component placement, panel design, and mechanical tolerances to help prevent damage during separation.